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High-Temperature Capacitor Films

Low-loss engineered fluoropolymer film for aerospace power electronics and harsh-environment capacitors, maintaining voltage and capacitance stability under heat, field stress and long energized duty.

4 μm filmLow dielectric lossHigh-temperature capacitance stability
PRODUCT FAMILYPower Enablers
High-temperature capacitor film and wound capacitor construction
POWER / FILM / Representative construction · Final design follows the approved specification

01 / CONFIGURATION DIRECTIONS

Select a configuration from the application boundaries

These configurations establish a practical discussion starting point. The final product requires a controlled specification based on interface, length, installation and validation conditions.

01

Aerospace power electronics

For high-power-density inverter, power-module and DC-link capacitor directions.

02

High-temperature industrial

For long-life systems with limited cooling or elevated ambient temperature.

03

Custom wound element

Film and metallization are defined by capacitance, voltage, width and package.

Match a solution direction to the link target

Solution codes support early technical discussions by aligning protocol, construction, link boundaries and application in one view.

SOLUTION CODEPROTOCOL / RATECONSTRUCTIONKEY BOUNDARYBEST FIT
POWER-FILM-01Aerospace power electronicsFor high-power-density inverter, power-module and DC-link capacitor directions.4 μm filmAerospace and defense power electronics
POWER-FILM-02High-temperature industrialFor long-life systems with limited cooling or elevated ambient temperature.Low dielectric lossHigh-temperature inverter and DC link
POWER-FILM-03Custom wound elementFilm and metallization are defined by capacitance, voltage, width and package.High-temperature capacitance stabilityDownhole tools

MODEL NOTEFilm values are material-level data. Finished-capacitor capability also depends on metallization, winding, package, cooling and electric-field design.

02 / PERFORMANCE PARAMETERS

Product performance parameters

The following values describe current product performance boundaries, with the applicable model, construction or test condition retained.

PERFORMANCE METRICVALUECONFIGURATION / CONDITION
01Temperature range−55 to +200 °C

Film material

02Material constructionEngineered fluoropolymer

Material system

03Film thickness4 μm

Standard value

04Dielectric constant2.1

Material property

05Loss tangent0.0002

Tanδ

06Insulation resistance7,000,000 MΩ × μF

At 25 °C

These are high-temperature capacitor-film material properties; finished-capacitor values still depend on metallization, winding and package design.

Technical referenceValues are confirmed against category, gauge, length and termination

03 / TYPICAL CONSTRUCTION

From functional core to terminated interface

LAYER 01

Functional film

Engineered fluoropolymer film forms the low-loss dielectric core.

LAYER 02

Metallized electrodes

Metal layers are defined around capacitance, current density and self-healing.

LAYER 03

Winding or stack

Tension, alignment and edge control maintain thickness and field consistency.

LAYER 04

End connection

Low-resistance interfaces control pulse current and localized heating.

LAYER 05

Package system

Potting, enclosure and thermal path support vibration and elevated temperature.

04 / SELECTION & VALIDATION

Inputs needed to start a custom assessment

SELECTION ITEMINFORMATION TO CONFIRM
01Electrical target

Capacitance, working voltage, ripple current and peak power

02Thermal boundary

Continuous temperature, hot spots and thermal cycling

03Loss target

Dielectric loss, ESR and allowable temperature rise

04Mechanical envelope

Film thickness, winding size, package and mass

05Manufacturing

Metallization, winding, end spray and encapsulation

06Life validation

Voltage, temperature, vibration and capacitance drift

Typical applications

  • Aerospace and defense power electronics
  • High-temperature inverter and DC link
  • Downhole tools
  • High-reliability pulse and filter capacitors

Interfaces & delivery

  • Wound or stacked capacitor element
  • Custom width, thickness and roll diameter
  • Busbar, lead or module termination
ENGINEERING NOTE

Film values are material-level data. Finished-capacitor capability also depends on metallization, winding, package, cooling and electric-field design.

Ready to define a controlled specification?

Bring us the interface, environment and validation requirements.

Yidong Telecom can build a sample direction and validation matrix around the cable construction, termination and system boundaries.

Submit requirement checklist